ScienceDaily: Consumer Electronics News |
- 3-D 'pop-up' silicon structures: Transforming planar materials into 3-D microarchitectures
- Neuroprosthetics for paralysis: Biocompatible, flexible implant slips into the spinal cord
- Defying the Achilles heel of 'wonder material' graphene: Resilience to extreme conditions
| 3-D 'pop-up' silicon structures: Transforming planar materials into 3-D microarchitectures Posted: 08 Jan 2015 11:47 AM PST Researchers have invented simple routes to complex classes of 3-D micro/nanostructures in high performance materials, with relevance to electronics, photovoltaics, batteries, biomedical devices, and other microsystems technologies.  |
| Neuroprosthetics for paralysis: Biocompatible, flexible implant slips into the spinal cord Posted: 08 Jan 2015 11:47 AM PST New therapies are on the horizon for individuals paralyzed following spinal cord injury. The e-Dura implant can be applied directly to the spinal cord without causing damage and inflammation, scientists report.  |
| Defying the Achilles heel of 'wonder material' graphene: Resilience to extreme conditions Posted: 08 Jan 2015 05:48 AM PST A resilience to extreme conditions by the most transparent, lightweight and flexible material for conducting electricity could help revolutionize the electronic industry, according to a new study. Researchers have discovered that a material adapted from the 'wonder material' graphene can withstand prolonged exposure to both high temperature and humidity.  |
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