RefBan

Referral Banners

Yashi

Tuesday, October 21, 2014

ScienceDaily: Engineering and Construction News

ScienceDaily: Engineering and Construction News


See-through sensors open new window into the brain

Posted: 20 Oct 2014 06:23 PM PDT

Developing invisible implantable medical sensor arrays, a team of engineers has overcome a major technological hurdle in researchers' efforts to understand the brain. The team has now described its technology, which has applications in fields ranging from neuroscience to cardiac care and even contact lenses.

See-through, one-atom-thick, carbon electrodes powerful tool to study brain disorders

Posted: 20 Oct 2014 11:15 AM PDT

A graphene, one-atom-thick microelectrode now solves a major problem for investigators looking at brain circuitry. Pinning down the details of how individual neural circuits operate in epilepsy and other brain disorders requires real-time observation of their locations, firing patterns, and other factors.

Facetless crystals that mimic starfish shells could advance 3-D-printing pills

Posted: 20 Oct 2014 07:55 AM PDT

In a design that mimics a hard-to-duplicate texture of starfish shells, engineers have made rounded crystals that have no facets.

Crystallography: Towards controlled dislocations

Posted: 20 Oct 2014 07:53 AM PDT

Scientists have used atomic-resolution Z-contrast imaging and X-ray spectroscopy in a scanning transmission electron microscope to explore dislocations in the binary II-VI semiconductor CdTe, commercially used in thin-film photovoltaics. The results may lead to eventual improvement in the conversion efficiency of CdTe solar cells. These novel insights into atomically resolved chemical structure of dislocations have potential for understanding many more defect-based phenomena.

1980s American aircraft helps quantum technology take flight

Posted: 20 Oct 2014 07:50 AM PDT

The X-29, an American experimental aircraft has inspired quantum computing researchers in a development which will bring the technology out of the lab.

Goldilocks principle wrong for particle assembly: Too hot and too cold is just right

Posted: 20 Oct 2014 07:47 AM PDT

Microscopic particles that bind under low temperatures will melt as temperatures rise to moderate levels, but re-connect under hotter conditions, a team of scientists has found. Their discovery points to new ways to create "smart materials," cutting-edge materials that adapt to their environment by taking new forms, and to sharpen the detail of 3D printing.

No comments:

Yashi

Chitika